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Automation Equipment
Substrate Lamination Machine
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Suitable for substrates ranging from 5mm (W) x 5mm (L) to 30mm (W) x 30mm (L). 。
Bonding thickness for substrates is between 1.5mm and 2.5mm
Base tray size range is from 100mm (W) x 100mm (L) to 500mm (W) x 500mm (L).
Substrate bonding accuracy reaches ≦ ±0.02mm.
Both loading and unloading use a clamp method to reduce the operational burden on personnel.
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